spec no: dsak2938 rev no: v.3 date: jul/17/2010 page: 1 of 9 approved: wynec checked: allen liu drawn: y.l.li e rp: 1212000207 2.15x1.7mm smd led with ceramic substrate package dimensions attention observe precautions for handling electrostatic discharge sensitive devices notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25(0.01") unless otherwise noted. 3. the specifications, characteristics and technical data descri bed in the datasheet are subject to change without prior notice . 4. the device has a single mounting surface. the devi ce must be mounted according to the specifications. application note static electricity and surge damage the leds. it is recommended to use a wrist band or anti-electrostatic glove when handling the leds. all devices, equipment and machinery must be electrically grounded. features z dimension: 2.15mmx 1.7mm x 0.8mm. z low thermal resistance. z ceramic package with silicone resin. z small package with high efficiency. z surface mount technology. z esd protection. z package : 2000pcs / reel. z moisture sensitivity level : level 2a. z soldering methods: ir reflow soldering. z rohs compliant. typical applications digital still cameras. camera-phones. pdas. room lighting. architectural lighting. decorative/pathway lighting. front panel backlight. part number: AT2117QB25Z1S-VFS blue chip
spec no: dsak2938 rev no: v.3 date: jul/17/2010 page: 2 of 9 approved: wynec checked: allen liu drawn: y.l.li e rp: 1212000207 absolute maximum ratings at t a =25c notes: 1. results from mounting on pc board fr4,m ounted on pc board-metal core pcb is recommend for lowest thermal resistance. 2. 1/10 duty cycle, 0.1ms pulse width. electrical / optical characteristics at t a =25c parameter symbol value unit operating temperature top -40 to + 1 0 0 c storage temperature ts t g -40 to + 11 0 c junction temperature[1] t j 110 c dc forward current [1] i f 150 ma peak forward current [2] i fm 300 ma reverse voltage v r 5 v power dissipation p d 0.6 w 8000 v thermal resistance [1] (junction/ambient) r th j-a 170 c/w thermal resistance [1] (junction/solder point) r th j-s 55 c/w electrostatic dischar ge threshold (hbm) parameter symbol value unit wavelength at peak emission i f =150ma [typ.] peak 445 nm dominant wavelength i f =150ma [typ.] dom [1] 450 nm spectral line half-width i f =150ma [typ.] ? 20 nm forward voltage i f =150ma [min.] v f [2] 2.7 v forward voltage i f =150ma [typ.] 3.5 forward voltage i f =150ma [max.] 4.0 reverse current v r =5v [max.] i r 10 a temperature coefficient of peak i f =150ma, -10 c t 100 c [typ.] tc peak 0.13 nm/ c temperature coefficient of dom i f =150ma, -10 c t 100 c [typ.] tc dom 0.1 nm/ c temperature coefficient of v f i f =150ma, -10 c t 100 c [typ.] tc v -3.1 mv/ c optical efficiency opt 8.19 lm/w notes: 1.wavelength is measured with a current pulse of 20ms at a tolerance of 1nm. 2.forward voltage is measured with a curr ent pulse of 10ms at a tolerance of 0.1v.
spec no: dsak2938 rev no: v.3 date: jul/17/2010 page: 3 of 9 approved: wynec checked: allen liu drawn: y.l.li e rp: 1212000207 selection guide part no. dice lens type luminous intensity [2] iv(cd)@ 150ma v (lm) [3] @ 150ma v iewing angle [1] min. typ. typ. 2 1/2 AT2117QB25Z1S-VFS blue (ingan) water clear 0.48 0.8 4.3 120 forward voltage unit min. max. 2.7 2.9 v 2.9 3.1 v 3.1 3.3 v 3.3 3.6 v 3.6 3.9 v 3.9 4.1 v forward voltage groups brightness codes luminous intensity [2] iv(cd) @ 150ma v (lm) [3] @ 150ma code. min. max. typ. s 0.48 0.75 3.5 t 0.65 1.1 4.3 u 0.9 1.5 5 notes: 1. 1/2 is the angle from optical centerline where the lu minous intensity is 1/2 of the optical peak value. 2.luminous intensity is measured by a current pulse of 10ms at a tolerance of 15%. 3.the typical data of luminous flux can only reflect statistical figures, actual par ameters of individual product could differ from the typical data. for the purpose of product enhancement, the typica l data is subject to change without prior notice. shipment may contain more than one of the light intensity groups. orders for single light intensity group are generally not accepted. notes: forward voltage is measured with a current pulse of 10ms at a tolerance of 0.1v. shipment may contain more than one of the forward voltage groups. orders for single forward voltage group are generally not accepted.
spec no: dsak2938 rev no: v.3 date: jul/17/2010 page: 4 of 9 approved: wynec checked: allen liu drawn: y.l.li e rp: 1212000207 AT2117QB25Z1S-VFS
spec no: dsak2938 rev no: v.3 date: jul/17/2010 page: 5 of 9 approved: wynec checked: allen liu drawn: y.l.li e rp: 1212000207
spec no: dsak2938 rev no: v.3 date: jul/17/2010 page: 6 of 9 approved: wynec checked: allen liu drawn: y.l.li e rp: 1212000207 AT2117QB25Z1S-VFS heat generation: 1.thermal design of the end product is of paramount importanc e.please consider the heat genera tion of the led when making the system design. the coefficient of temperature increase per i nput electric power is affected by the thermal resistance of th e circuit board and density of led placement on the board ,as well as other components. it is necessary to avoid intense heat gen - eration and operate within the maximum ra tings given in this specification. 2.please determine the operating current with consideration of the ambient temperature local to the led and refer to the plot of permissible forward current vs. ambient temperature on ch aracteristics in this specific ation. please also take meas- ures to remove heat from the area near the led to improve the operational c haracteristics on the led. 3.the equation indicates correlation between t j and t a ,and the equation indicates correlation between t j and t s t j = t a + r thj-a *w ??? tj = t s + r thj-s *w ??? tj = dice junction temperature: c t a = ambient temperature:c t s = solder point temperature:c r thj-a = heat resistance from dice junction temper ature to ambient temperature : c / w r thj-s = heat resistance from dice junction temper ature to ts measuring point : c / w w = inputting power (ifx vf) : w reflow soldering is recommended and the soldering profile is shown below. other soldering methods are not recommended as they might cause damage to the product.
spec no: dsak2938 rev no: v.3 date: jul/17/2010 page: 7 of 9 approved: wynec checked: allen liu drawn: y.l.li e rp: 1212000207 recommended soldering pattern (units : mm; tolerance: 0.1) reel dimension tape specifications (units : mm)
spec no: dsak2938 rev no: v.3 date: jul/17/2010 page: 8 of 9 approved: wynec checked: allen liu drawn: y.l.li e rp: 1212000207 packing & label specifications AT2117QB25Z1S-VFS
spec no: dsak2938 rev no: v.3 date: jul/17/2010 page: 9 of 9 approved: wynec checked: allen liu drawn: y.l.li e rp: 1212000207 handling precautions compare to epoxy encapsulant that is hard and brittle, si licone is softer and flexible. although its characteristic significantly reduces thermal stress, it is more su sceptible to damage by external mechanical force. as a result, special handling precau tions need to be observed during asse mbly using silicone encapsulated led products. failure to comply might leads to damage and premature failure of the led. 1. handle the component along the side surfaces by using forceps or appropriate tools. 2. do not directly touch or handle the silicone lens surface. it may damage the internal circuitry. 3. do not stack together assembled pcbs containing ex posed leds. impact may scratch the silicone lens or damage the internal circuitry. 4. the outer diameter of the smd pickup nozzle should not exceed t he size of the led to prevent air leaks. the inner diameter of the nozzle should be as large as possible. 5. a pliable material is suggested for the nozzle tip to avoid scratching or damaging the led surface during pickup. 6. the dimensions of the component must be accurately progra mmed in the pick-and-place machine to insure precise pickup and avoid damage during production.
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